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| 74LX1G07 Single buffer/driver with open drain Features 5 V tolerant inputs High speed: tPD = 4.2 ns (max.) at VCC = 3.3 V Low power dissipation: - ICC = 1 A (max.) at TA = 25 C Power down protection on inputs and outputs Operating voltage range: - VCC (opr) = 1.65 to 5.5 V Latch-up performance exceeds 300 mA (JESD 17) ESD performance - 2000-V human body model (JESD 22 A114-A) - 200-V machine model (JESD 22 A115-A) - 1000-V charge device model (JESD 22 C101) Flip-chip 4 SOT23-5L SOT323-5L Description The 74LX1G07 is a low voltage CMOS single buffer/driver (open drain) fabricated with submicron silicon gate and double-layer metal wiring C2MOS technology. The internal circuit composed of 2 stages including buffer output, provides high noise immunity and stable output. Power down protection is provided on input and 0 to 7 V can be accepted on input with no regards to the supply voltage. This device can be used to interface 5 to 3 V. Applications Mobile phones Table 1. Device summary Order code 74LX1G07STR 74LX1G07CTR 74LX1G07BJR Package SOT23-5L SOT323-5L Flip-chip 4 Packaging Tape and reel Tape and reel Tape and reel April 2008 Rev 9 1/20 www.st.com 20 Contents 74LX1G07 Contents 1 2 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Recommended operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 4 5 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 2/20 74LX1G07 Pin connection 1 Pin connection Figure 1. Pin connection and IEC symbols V CC 5 1Y 4 GND 1A 2 1 3 1Y VCC 1A GND 1 2 4 3 VCC 1Y 4 1 NC 2 3 Flip-chip 4 Bottom view Flip-chip 4 Top view CS00012 1A GND SOT package Top view Table 2. Pin assignments Pin number Symbol Name and function No connection Data input Data output Ground (0V) Positive supply voltage Flip-chip 4 SOT 1 2 4 3 5 NC 1A 1Y GND VCC - 1 3 2 4 Table 3. Truth table A L H Y L Z Z: High impedance 3/20 Pin connection Figure 2. Input and output equivalent circuit V CC 74LX1G07 Overvoltage control Input Output ESD protection ESD protection GND GND GND GND GND CS08973 4/20 74LX1G07 Maximum rating 2 Maximum rating Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. Symbol VCC VI VO VO IIK IOK IO ICC IGND Tstg TL Supply voltage DC input voltage DC output voltage (VCC = 0 V) DC output voltage (high or low state) DC input diode current DC output diode current DC output current DC supply current per supply pin DC ground current per supply pin Storage temperature Lead temperature (10 sec) Absolute maximum ratings Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -0.5 to VCC + 0.5 - 50 - 50 50 100 100 -65 to +150 300 Unit V V V V mA mA mA mA mA C C 5/20 Maximum rating 74LX1G07 2.1 Recommended operating conditions Table 5. Symbol VCC VI VO VO IOL IOL IOL IOL IOL Top dt/dv Supply voltage Input voltage Output voltage (VCC = 0 V) Output voltage (high or low state) High or low level output current (VCC = 4.5 to 5.5 V) High or low level output current (VCC = 3.0 to 3.6 V) High or low level output current (VCC = 2.7 to 3.0 V) High or low level output current (VCC = 2.3 to 2.7 V) High or low level output current (VCC = 1.65 to 2.3 V) Operating temperature Input rise and fall time Recommended operating conditions Parameter Value 1.65 to 5.5 0 to 5.5 0 to 5.5 0 to VCC + 32 +24 +12 +8 +4 -40 to 85 0 to 10 Unit V V V V mA mA mA mA mA C ns/V 6/20 74LX1G07 Electrical characteristics 3 Electrical characteristics Table 6. DC specifications Test condition Symbol Parameter VCC (V) 1.65 - 1.95 VIH High level input voltage 2.3 - 2.7 3.0 - 5.5 1.65 - 1.95 VIL Low level input voltage 2.3 - 2.7 3.0 - 5.5 1.65 - 4.5 1.65 VOL Low level output voltage 2.3 3.0 4.5 IOZ High impedance output leakage current Input leakage current Power off leakage current Quiescent supply current 3.6 1.65 - 5.5 0 1.65 - 5.5 3.6 IO = 100 A IO = 4 mA IO = 8 mA IO = 16 mA IO = 24 mA IO = 32 mA VI = 5.5 V VI = 0 -5.5 V VI or VO = 5.5 V VI = VCC or GND VI or VO = 3.6 to 5.5 V Value -40 to 85 C Min 0.65 VCC 0.7 VCC 0.7 VCC 0.35 VCC 0.3 VCC 0.3 VCC 0.1 0.45 0.3 V 0.4 0.55 0.55 10 5 10 10 10 A A A A V V Max Unit II Ioff ICC 7/20 Electrical characteristics Table 7. AC electrical characteristics Test conditions Symbol Parameter VCC (V) 1.65 - 1.95 2.3 - 2.7 tPLZ Propagation delay time 2.7 3.0 - 3.6 4.5 - 5.5 1.65 - 1.95 2.3 - 2.7 tPZL Propagation delay time 2.7 3.0 - 3.6 4.5 CL (pF) 30 30 50 50 50 30 30 50 50 50 R1 () 1000 500 500 500 500 1000 500 500 500 500 ts = tr (ns) 2.0 2.0 2.5 2.5 2.5 2.0 2.0 2.5 2.5 2.5 Value -40 to 85 C Min 1.8 1.2 1 0.8 0.5 1.8 1.2 1 0.8 0.5 Max 8.3 5.5 5 4.2 3.5 8.3 5.5 5 4.2 3.5 74LX1G07 Unit ns ns -5.5 Table 8. Capacitive characteristics Test conditions Value TA = 25 C Min VIN = 0 or VCC VIN = 0 or VCC Typ 2.5 4 8 fIN = 10 MHz 8 8 pF Max pF pF Unit Symbol Parameter VCC (V) 3.3 3.3 1.8 CIN COUT Input capacitance Output capacitance Power dissipation capacitance(1) CPD 2.5 3.3 1. CPD is defined as the value of the IC's internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to test circuit). Average operating current can be obtained by the following equation: ICC(opr) = CPD x VCC x fIN + ICC 8/20 74LX1G07 Figure 3. Test circuit Electrical characteristics VCC VCC R1 Pulse generator D.U.T RT CL CS07201 Table 9. Test circuit and waveform symbol value VCC Symbol 1.65 CL R1 VIH VM tr = tf - 1.95 V 2.3 - 2.7 V 30 pF/ 50 pF 500 VCC VCC/2 < 2.0 ns 2.7 - 5.5 V 50 pF 500 VCC VCC/2 < 2.5 ns 30 pF 1000 VCC VCC/2 < 2.0 ns Figure 4. Waveform: propagation delay (f = 1 MHz; 50% duty cycle) 9/20 Package mechanical data 74LX1G07 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 5. SOT23-5L package outline . 7049676C Table 10. Symbol SOT23-5L mechanical data millimeters Typ Min Max 1.45 0.10 1.30 0.50 0.20 3.00 1.75 0.95 2.60 0.10 3.00 0.60 102.3 3.9 Typ 35.4 0.0 35.4 13.7 3.5 110.2 59.0 37.4 118.1 23.6 mils Min Max 57.1 3.9 51.2 19.7 7.8 118.1 68.8 A A1 A2 b C D E e H L 0.90 0.00 0.90 0.35 0.09 2.80 1.50 10/20 74LX1G07 Figure 6. SOT323-5L package outline Package mechanical data Table 11. Symbol SOT323-5L mechanical data millimeters Typ Min Max 1.10 0.10 1.00 0.30 0.18 2.20 2.20 1.35 0.65 1.3 0.10 0.30 3.9 Typ 31.5 0.0 31.5 5.9 3.9 70.9 70.9 45.3 25.6 51.2 11.8 mils Min Max 43.3 3.9 39.4 11.8 7.1 86.6 94.5 53.1 A A1 A2 b C D E E1 e e1 L 0.80 0.00 0.80 0.15 0.10 1.80 1.80 1.15 11/20 Package mechanical data Figure 7. Flip-chip 4 package outline 74LX1G07 12/20 74LX1G07 Table 12. Flip-chip 4 mechanical data millimeters Symbol Min A A1 A2 b D D1 E E1 SD SE f ccc 0.175 0.84 0.535 0.18 0.355 0.215 0.84 Typ 0.58 0.205 0.375 0.255 0.87 0.5 0.87 0.5 0.25 0.25 0.185 0.080 Package mechanical data Max 0.625 0.23 0.395 0.295 0.9 0.9 0.195 13/20 Package mechanical data Figure 8. Flip-chip 4 recommended footprint 74LX1G07 14/20 74LX1G07 Figure 9. SOT23-xL tape and reel Package mechanical data Table 13. Symbol SOT23-xL tape and reel mechanical data millimeters Typ Min Max 180 12.8 20.2 60 14.4 3.13 3.07 1.27 3.9 3.9 3.23 3.17 1.37 4.0 4.0 3.33 3.27 1.47 4.1 4.1 0.123 0.120 0.050 0.153 0.153 0.127 0.124 0.054 0.157 0.157 13.0 13.2 0.504 0.795 2.362 0.567 0.131 0.128 0.058 0.161 0.161 0.512 Typ inches Min Max 7.086 0.519 A C D N T Ao Bo Ko Po P 15/20 Package mechanical data Figure 10. SOT323-xL tape and reel 74LX1G07 1. Drawing not to scale. Table 14. Symbol SOT323-xL tape and reel mechanical data millimeters Typ Min 180 13 Max 185 13.2 Typ 6.889 0.504 0.795 60 60.5 14.4 2.25 2.7 1.2 3.9 3.8 4 4 4.1 4.2 0.153 0.149 0.088 0.106 0.047 0.157 0.157 0.161 0.165 2.362 0.567 inches Min 7.086 0.512 Max 7.283 0.519 A C D N T Ao Bo Ko Po P 175 12.8 20.2 59.5 16/20 74LX1G07 Figure 11. Flip-chip 4 reel information - back side Package mechanical data Figure 12. Flip-chip 4 reel information - front side 17/20 Package mechanical data Figure 13. Flip-chip 4 carrier tape information 74LX1G07 Figure 14. Flip-chip 4 tape orientation Tape and reel A1 - Top view of package - Balls underneath - Pin A1 marked from target spec direction of flow 18/20 74LX1G07 Revision history 5 Revision history Table 15. Date 04-Sept-2004 03-May-2006 17-Jan-2008 29-Jan-2008 Document revision history Revision 4 5 6 7 Document change. Data reel updating. Document restructured and converted to new ST template. Added 74LX1G07BJR and related package information. Flip-Chip 4 replaced with Flip-chip 4 and updated Table 12 on page 13. Replaced Flip-Chip 4 package name with Flip-chip 4, latch-up and ESD performance among the specifications in the cover page and updated Table 6 on page 7, Table 8 on page 8, and Table 12 on page 13, replaced Figure 13 on page 18 and Figure 14 on page 18 Modified: Table 12 on page 13 and Figure 13 on page 18. Changes 21-Feb-2008 8 23-Apr-2008 9 19/20 74LX1G07 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 20/20 |
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